Recover Complete Understanding of
[Technical Recovery]

Recover Complete Understanding of
Any Product

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Reverse Engineering & Documentation

Recover full technical understanding of any existing product — with complete documentation, schematics, and improvement analysis.

Our Approach

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At Kabani Tech, we reverse engineer physical products and systems to produce complete technical documentation when original files are unavailable, lost, or never existed. This applies to legacy hardware, acquired products, competitor benchmarking, and orphaned designs.

Our output gives engineering teams the foundation they need to maintain, improve, or replicate a product — without starting from scratch or guessing at the original design intent.

What we deliver

Services We Offer

01

Hardware Teardown

Physical disassembly, component identification, and layer-by-layer PCB analysis.

01Layer Stackup Analysis#
02Component Identification & Sourcing#
03PCB Photography & Mapping#
04Assembly Documentation#
05Mechanical Measurement#

Of acquired hardware products lack complete engineering documentation.

71%
02

Schematic Recreation

Reverse engineering the complete circuit schematic from physical board analysis.

01Net Tracing#
02Schematic Capture#
03Power Domain Mapping#
04Signal Flow Documentation#
05Verification Testing#

Average time saved vs. designing from scratch with reverse-engineered schematics.

60%
03

Firmware Analysis

Extracting, disassembling, and documenting firmware behaviour from production hardware.

01Flash Extraction#
02Disassembly & Decompilation#
03Protocol Reverse Engineering#
04RTOS Identification#
05Functional Documentation#

Of embedded products have no recoverable source code when the team changes.

48%
04

Improvement Analysis

Identifying design weaknesses, obsolete components, and upgrade opportunities in the existing product.

01Obsolescence Review#
02Cost Reduction Opportunities#
03Performance Bottlenecks#
04Reliability Issues#
05Upgrade Roadmap#

Average component cost reduction found in legacy product re-analysis.

18%

Our step-by-step custom process

First, we audit your brand and goals. You get full transparency, fast turnarounds, and results that speak for themselves.

Scale Your Brand
01

Sample Receipt & Assessment

Product units received, catalogued, and initially assessed for complexity and documentation scope.

02

Physical Analysis

Teardown, layer analysis, component identification, and firmware extraction performed under controlled conditions.

03

Documentation Creation

Schematics, BOM, mechanical drawings, firmware documentation, and assembly notes produced from analysis findings.

04

Review & Handover

Documentation package reviewed with the client team, gaps addressed, and files handed over in agreed formats.

Common questions

Frequently Asked

01

Is reverse engineering of competitor products legal?

Reverse engineering for interoperability, research, and benchmarking is generally permitted under most jurisdictions. We do not reproduce or clone products for resale.

02

How many product samples do you need?

Typically two to three units — one for non-destructive analysis and one or two for destructive layer analysis if required.

03

Can you recover firmware from read-protected chips?

We can attempt extraction using fault injection and side-channel techniques on some devices, but success depends on the security implementation. We assess this during initial review.

04

What file formats are the deliverables in?

Schematics in your preferred EDA format (Altium, KiCad, Eagle), BOM as Excel/CSV, mechanical drawings as DXF/STEP, and documentation as PDF.

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